Packaging Development Engineer in Toulouse

Build the devices that will power sustainable electrification worldwide!

AlpSemi is an industrial deep tech company building next-generation semiconductor power switches.

We are driving a generational technology shift: enabling the large-scale adoption of Solid-State Circuit Breakers, a breakthrough technology set to transform power protection and distribution, much like LEDs transformed lightning and digital cameras transformed photography.

Our technologies address one of the biggest challenges of our time: enabling sustainable electrification at scale byoptimizingpower consumption across global markets such as IA data centers, thereby improving access to electricity worldwide.

As we grow, we are looking for a passionate and hands-on Packaging Development Engineer who wants to push the boundaries of conventional semiconductor packaging and contribute to the development of innovative power packages and future module technologies.

You will play a key role in defining and developing advanced packaging architectures, combining electrical and thermal simulation, technology innovation, and close co-development with specialized packaging partners.

Working within a collaborative and agile engineering team, you will explore new assembly technologies, optimize package performance, and work directly with innovative suppliers, OSATs, and technology partners to bring advanced packaging concepts from early design to industrial implementation.

This is an opportunity to go beyond traditional packaging engineering: to influence product architecture, develop new integration concepts, and help build the packaging technologies that will enable AlpSemi’s future generations of power semiconductor products.

Responsibilities

• Drive advanced packaging development: Define and develop innovative package architectures for high-current, high-voltage, and fast-switching power semiconductor devices, from discrete packages to future power modules.
• Explore and co-develop new technologies: Work closely with innovative packaging suppliers, OSATs, and technology partners to identify, evaluate, and co-develop advanced assembly processes, interconnection solutions, materials, and integration concepts.
• Lead electrical and thermal simulation: Perform and coordinate electrothermal simulations, including current distribution, parasitic resistance and inductance, heat spreading, thermal resistance and impedance, to guide design decisions and optimize package performance.
• Translate simulation into hardware: Correlate simulation results with experimental measurements and characterization data, refine models, and drive continuous improvements in package architectures.
• Optimize package robustness: Evaluate electrical, thermal, and mechanical design trade-offs to ensure performance, manufacturability, and long-term reliability.
• Develop innovative integration concepts: Investigate advanced interconnection technologies, low‑inductance structures, and emerging power module architectures.
• Build confidence in packaging technologies: Define and support package qualification activities, investigate assembly‑related failure mechanisms, and contribute to reliability improvement plans.
• Drive backend development and industrialization: Collaborate with manufacturing partners to optimize assembly processes, address technical challenges, and support the transition from prototypes to scalable manufacturing solutions.
• Contribute to product and system performance: Work closely with Technology, Product Characterization, and Application Engineering teams to ensure packaging solutions meet device-level and system-level requirements.
• Shape the packaging roadmap: Monitor emerging technologies, propose innovative approaches, and contribute to AlpSemi’s long‑term packaging and backend development strategy.

Job requirements

• Engineering degree or MSc in Electrical Engineering, Materials science, Mechanical Engineering, Physics, or a related field.
• Typically 5–10 years of experience in semiconductor packaging, advanced electronic assemblies, power electronics, or related development activities.
• Strong understanding of semiconductor packaging technologies, assembly processes, materials, and interconnection methods.
• Experience in electrical and/or thermal simulation, with the ability to perform simulation , interpret results and translate them into practical design improvements.
• Familiarity with simulation tools such as ANSYS, COMSOL or equivalent multiphysics simulation environments is highly appreciated.
• Understanding of the impact of package parasitics, thermal management, and interconnection technologies on power semiconductor performance.
• Experience collaborating with OSATs, packaging suppliers, subcontractors, or technology development partners.
• Knowledge of semiconductor packaging reliability, qualification methodologies, and failure mechanisms.
• Experience with Wide Bandgap technologies (GaN, SiC), advanced cooling concepts, or power module integration is an advantage.
• Curious, pragmatic, and comfortable combining simulation, hands‑on experimentation, and technology development.
• Autonomous and proactive, with the ability to take initiative, challenge established approaches, and contribute effectively in a dynamic startup environment.
• Strong communication skills and enthusiasm for multidisciplinary and international collaboration.

What we offer

Joining AlpSemi is an opportunity to accelerate your growth, unlock your potential and develop the skills, mindset and ownership that will shape your entire career. From day one, you will work on meaningful technical challenges, learning from experienced entrepreneurs and engineers, and contribute to building products that will redefine one of the most critical infrastructures in our society: power systems.

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